SEPRAYS at NEPCON ASIA 2026: Connecting Through PCB Depaneling and Automation

SEPRAYS at NEPCON ASIA 2026 Connecting Through PCB Depaneling and Automation

October 27–29, 2026 | Shenzhen, China

SEPRAYS is participating in NEPCON ASIA 2026, taking place October 27-29 at the Shenzhen World Exhibition & Convention Center.

At Hall 13, Booth 13F76, the event provides an opportunity to connect with electronics manufacturing professionals and exchange perspectives on PCB depaneling, production automation, and evolving manufacturing requirements.

Exploring PCB Depaneling and Automation

As electronic products become increasingly compact and complex, PCB separation remains an important consideration in electronics manufacturing.

Different production environments require different approaches to depaneling. Factors such as board design, component placement, production volume, processing accuracy, and manufacturing workflow can all influence the choice of separation technology.

Laser depaneling and automated mechanical separation offer different advantages depending on the application. Understanding these differences helps manufacturers evaluate processing methods according to their specific production requirements.

Industry exhibitions such as NEPCON ASIA create opportunities to discuss these technical considerations and learn how manufacturing technologies continue to evolve.

Connecting with the Electronics Manufacturing Community

Beyond equipment and technology, industry exhibitions are valuable for the conversations they bring together.

Manufacturers, engineers, and industry professionals can share experiences, discuss production challenges, and learn about emerging manufacturing trends.

For SEPRAYS, participating in NEPCON ASIA is an opportunity to engage with the wider electronics manufacturing community and follow developments in PCB depaneling and automation.

Visit SEPRAYS at NEPCON ASIA 2026

Event: NEPCON ASIA 2026

Dates: October 27–29, 2026

Venue: Shenzhen World Exhibition & Convention Center, Shenzhen, China

Hall: 13

Booth: 13F76

We look forward to meeting industry professionals, exchanging ideas, and exploring the evolving landscape of electronics manufacturing.

NEPCON ASIA 2026 is another opportunity to connect technology with real-world manufacturing needs.

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