ZAM310L Offline Precision Laser Depaneling Machine

ZAM310L Offline Precision Laser Depaneling Machine offers high-precision, non-contact cutting for PCBs, FPCs, and various advanced materials. Equipped with both UV and CO₂ laser options, it ensures minimal heat impact and clean, precise cuts for a variety of substrates, including FR4, LCP, MPI, PI, and ceramics. The machine features a granite base for stability, intelligent motion control for improved efficiency, and advanced software for quick and intuitive data processing. It supports both manual and automated loading/unloading systems, making it ideal for high-volume, batch production. With over 30 years of industry expertise, the ZAM310L guarantees excellent performance, reliable global service, and integration with industrial systems for seamless production workflows.

Specifications

Technical Specifications	ZAM310L
Laser Output Power	20W (15W, 25W, 35W, 60W optional)
Pulse Width	Nanosecond/Picosecond optional
Laser Wavelength	355nm/532nm
Maximum Working Area	520mm x 520mm (max. support 580mm x 580mm)
Device Platform	Granite platform, linear motor
X/Y/Z Axis Resolution	1μm
Repeat Positioning Accuracy	≤±2μm
Data Processing Software	CircuitCAM 7.5 Standard
Device Driver Software	DreamCreaTor 3
Camera Target Alignment System	Optional
Industrial Dust Collection System	Optional
Device Dimensions (W x H x D)	1,250mm x 1,560mm x 1,760mm
Device Weight	1,500kg
Power Supply	380VAC/50Hz, 3.5kW
Operating Temperature	22°C ± 2°C

The ZAM310L Offline Precision Laser Depaneling Machine is engineered to deliver exceptional accuracy, speed, and consistency in modern PCB and FPC manufacturing. Built with advanced laser technology, it offers a non-contact, stress-free cutting solution that protects delicate components while ensuring smooth, clean edges.

Superior Cutting Performance

The ZAM310L supports both UV and CO₂ lasers, giving manufacturers the flexibility to process a wide range of materials, including FR4, FR5, CEM, LCP, MPI, PI, PET, polyester films, ceramics (HTCC/LTCC), and RF substrates.

UV laser: ultra-fine cutting (25–40 μm kerf), minimal heat effect, no carbonisation.
CO₂ laser: wider kerf (120–220 μm), effective for thicker or high-volume cutting.

Precision and Stability

Granite base and gantry structure ensure rigidity and vibration-free operation.
Intelligent motion control optimises cutting paths for higher efficiency and better yield.
Advanced graphic editing software provides fast, intuitive data processing with a minimal learning curve.

Flexible Applications

The ZAM310L is ideal for:

PCB depaneling – accurate separation without mechanical stress.
FPC and coverlay cutting – delicate circuits handled with precision.
Gold finger and outline cutting – fine detail processing with reliable consistency.
Ceramic and RF material machining – stable results for specialised industries.

Automation Ready

Designed for batch production and industrial integration, the ZAM310L supports:

Manual or automated loading/unloading systems.
Standard industrial interfaces for seamless MES system connection.
Data collection, product tracking, and customised production flow.

Built for Industry Demands

Backed by over 30 years of expertise, this machine is trusted by global leaders in electronics, automotive, communications, energy, and medical technology. Certified with CE, ISO9001, ISO14001, and ISO45001, it guarantees both quality and safety.