ZAM300AT/330AT/330AD In-Line PCB Laser Depaneling Machine

Product Description

High-precision laser cutting for demanding PCB and FPC applications.

The ZAM series uses non-contact laser processing to separate PCBs with minimal mechanical stress.

It supports complex cutting paths, thin substrates, and sensitive electronic assemblies.

Designed for automated production lines, it helps manufacturers achieve consistent cutting quality with less manual handling.

• Non-contact laser cutting
• High-precision processing
• PCB and FPC applications
• Automated in-line production

Why Choose the ZAM300AT/330AT/330AD?

Non-Contact Processing

No mechanical cutting tool directly contacts the PCB during laser separation.

Reduced Mechanical Stress

Helps reduce stress-related risks for sensitive components and electronic assemblies.

Precision Cutting

Supports detailed cutting paths and complex PCB outlines.

Consistent Results

Controlled laser processing helps maintain repeatable cutting quality.

Automated Production

In-line integration helps reduce manual handling in PCBA manufacturing.

ZAM300AT/330AT/330AD Technical Specifications

Item	ZAM300AT	ZAM330AT	ZAM330AD
Valid cutting area	350*350mm(Double platforms)	300*300mm(Double platforms)
Data Processing Software	CircuitCAM 7.5
Operation System	Windows10 Operation Interface (Chinese)
Laser Source	Optional: Green/UV Laser, PS/NS
Machine precision	+20um
Repeat precision	+3um	+2um
X/Y axis resolution	+1um
Receive data format	Gerber, HPGL,Sieb&Meier,Excellon,ODB++
Wavelength	355nm/532nm
Laser power	Laser related
Equipment driver software	DreamCreaTor
CCD Camera	1.6 million-pixel industrial camera
Automatic load&unload system	Standard
Laser height sensor	Option
Camera target alignment system	Standard
Industrial vacuum system	Option
Environment temperature	22°C±2°C(71.6°F±2°F)
Voltage/Power requirement	3x3800V+N+PE, 50Hz (voltage regulator optional for specific voltages)
Dimensions (W × H × D)	940x 1720x1650mm	1750x 2320x1769mm
Weight	1500kg	1350kg

Precision Laser Cutting for Complex PCB Designs

Different PCB materials and cutting requirements call for different laser configurations.

The ZAM series supports UV and CO₂ laser options, depending on the application.

With UV laser processing, the cutting width can be as fine as 25–40 μm, subject to material and process conditions.

The system can be evaluated for applications involving copper, resin, ceramic, and RF materials.

Actual cutting quality depends on material composition, thickness, geometry, and selected laser configuration.

For demanding applications, share your PCB drawing and material specifications for evaluation.

Built for Automated PCBA Production

The ZAM300AT/330AT/330AD is designed for in-line PCB laser depaneling.

It can be configured for automated loading and unloading with robotic handling.

Dual worktables support continuous processing workflows.

CCD vision positioning and height measurement help align the PCB before cutting.

MES integration is available for production data tracking and quality management.

The final configuration depends on your production line, PCB dimensions, and automation requirements.

Applications of ZAM300AT/330AT/330AD

The ZAM series can be evaluated for applications that require precise cutting and reduced mechanical stress.

PCBA Depaneling

For separating individual boards from a PCB panel.

FPC Outline Cutting

For suitable flexible printed circuit materials and geometries.

Coverlay Window Opening

For selected flexible circuit processing applications.

Gold Finger Cutting

For suitable board designs and defined cutting requirements.

Advanced Materials

Potential applications include LCP, MPI, PI, PET, FR4, FR5, CEM, and HTCC/LTCC ceramics.

Material compatibility and cutting quality should be confirmed through application testing.

Is Laser Depaneling Right for Your PCB?

Laser depaneling may be suitable if your production involves:

• Components placed close to the PCB edge
• Thin or fragile substrates
• High-density PCB layouts
• Complex or irregular cutting paths
• Strict cutting precision requirements
• Sensitive assemblies where mechanical stress is a concern
• Automated in-line production

For conventional PCB designs with less demanding cutting requirements, PCB routing or V-groove separation may be more economical.

The right method depends on PCB design, material, production volume, edge quality, and process requirements.

Not sure which method fits your application?

Send us your PCB drawing and material details. Our team can help evaluate the suitable depaneling method and machine configuration.

Why Choose Seprays?

Choosing a laser depaneling machine involves more than cutting precision.

You also need to consider application suitability, automation requirements, production stability, and long-term support.

Seprays provides PCB depaneling equipment and automation solutions for different electronics manufacturing applications.

• 30+ years of PCB depaneling experience
• 26,000 m² manufacturing base
• 100+ patents
• Customers and markets across 31 overseas markets

Our team can help assess your PCB requirements and discuss a suitable laser depaneling solution.

Get a Quote for Your PCB Laser Depaneling Project

Looking for an in-line PCB laser depaneling machine?

Tell us about your PCB design and production requirements. We can help evaluate the appropriate model and configuration.

To speed up the evaluation, please share:

• PCB or FPC drawing
• Material type and thickness
• Panel dimensions
• Cutting path and quality requirements
• Expected production volume
• Automation or MES integration requirements

Send us your PCB drawing for an application review.

FAQ

1. How do I choose the right laser power for my PCB?

The required laser power depends on the PCB material, thickness, cutting path, and required processing speed. Our team can evaluate these factors before recommending a configuration.

2. Can I send PCB samples for a cutting test before placing an order?

Yes. You can provide PCB samples or drawings for an application evaluation. Sample testing can help verify cutting quality and processing suitability before you make a purchasing decision.

3. Can the machine be customized for my existing production line?

The machine configuration can be evaluated according to your production line layout, transfer height, loading and unloading method, and communication requirements. Please share your current line layout if customization is needed.

4. What is the expected processing speed for my PCB?

Processing speed depends on the cutting path, material, thickness, laser settings, and board complexity. We recommend evaluating your actual PCB design to estimate cycle time more accurately.

5. What training and after-sales support are available?

Available support can be discussed according to the purchase configuration and installation arrangement. Please contact our team to confirm operator training, technical assistance, maintenance guidance, and service options for your location.