ZAM330 PCB/FPC Laser Cutting

ZAM330 PCB/FPC Laser Cutting

ZAM330 Double Platform Laser Depaneling Equipment

ZAM330 adopts dual-table design, which saves the loading and unloading time, and keeps the laser always in the processing state. The processing area is 350mmx520mm, which is suitable for depaneling placed PCBs, open cover film window and other processes in SMT industry. It can also be equipped with camera target pre-positioning system, saving the processing time due to target positioning.

Optional

  • UV laser 15w, 20w, 25w or Green laser 35w, 60w
  • Laser Height Sensor
  • Barcode reader and MES system integration
  • Laser cam power detection
  • upgrade to Inline

 

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Specifications

Model ZAM330
Vaild cutting size 350mm×520mm
Cutting function Tweening to staight line,L shape,U shape,Circle,Arc
Process table Two
Repeat precision ±2μm
Cutting precision ±20μm
Ambient Temperatur 22℃±2℃(71.6℉±2℉)
Platform Marble  table
Transfer model（option） Mechanical transfer arm（scrap board throwing）
Laser wavelength 355nm/532nm
Receive Data Forma Gerber, HPGL, Sieb & Meier, Excellon, ODB++
Operation system Windows 7 / Windows 10
Target reads CCD automatic target capture Target shape is irregular,

no Target, DIL is required Modules
Cutting software DreamCreaTor
Data processing software CircuitCAM 7
XYZ-axis driving mode linear +servo motor
Voltage/Power requirement AC380V 50/60Hz 2.5KW three phase
Pneumatic pressure requirement 0.6MPa，50L/min
Dimensions(W*D*H) 1600mm x2100mm x1600mm
Weight 2000KG

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