ZAM330AT/330AD Online Laser Depaneling Machine Solution

The ZAM330AT/330AD Online Laser Depaneling Machine is a high-precision inline solution for stress-free PCB and FPC cutting. Equipped with UV and CO₂ laser options, it ensures clean, burr-free edges with minimal thermal impact.

Dual worktables and robotic handling enable continuous processing, while CCD vision and height measurement guarantee accurate alignment. Compatible with MES systems, it supports real-time data tracking and quality control.

Built with a granite base, advanced dust extraction, and cooling systems, the ZAM330AT/330AD delivers efficiency, consistency, and reliability for mass electronics production.

Specifications

Item ZAM330AT
Data Processing Software CircuitCAM 7
Operation Software DreamCeaTor 3
Laser Source Optional UV / Green / Infrared, Picosecond / Nanosecond
Max. Processing Area 300 mm × 300 mm (Dual Work Platforms)
Scan Galvo intelliSCAN + RTC5
Telecentric Lens Wavelength-dependent
Reflector Wavelength & Power-dependent
Motor Servo motor
Motion Control Card GTS-400
CCD Light Source Ring light
Industrial PC CPU: i5, Memory: 4G DDR3, HDD: 1TB
Display 17-inch LCD
Platform Structure Granite
Dimensions (W × H × D) 1620 mm × 1770 mm × 2250 mm

The ZAM330AT/330AD is an advanced online laser depaneling solution designed for high-precision, stress-free cutting of PCBs, FPCs, and a wide range of electronic substrates. With automated handling and seamless integration into SMT production lines, it ensures higher throughput, accuracy, and product quality.

Laser processing advantages

⚡ Precision Laser Cutting

  • Supports both UV and CO₂ laser options

  • Cut width as fine as 25–40 μm with UV

  • Minimal thermal impact, burr-free edges

  • Suitable for copper, resins, ceramics, and RF materials

Comparison of panel cutting

🔄 Fully Automated Inline Operation

  • Online loading and unloading with robotic arms

  • Dual worktables for continuous processing

  • Automatic alignment using CCD vision and height measurement

  • Supports integration with MES systems for data tracking and quality control

Comparison of board splitting efficiency

🛠 Flexible Applications

Ideal for:

  • PCBA depaneling

  • FPC outline cutting

  • Coverlay window opening

  • Gold finger cutting

  • Advanced materials: LCP, MPI, PI, PET, FR4, FR5, CEM, HTCC/LTCC ceramics

Versatile Applications

💡 Intelligent Control & Software

Equipped with proprietary hardware and software, the system offers:

  • Optimised cutting paths for speed and efficiency

  • GUI-based interface with a low learning curve

  • Optional advanced functions like Skywriting and precision drilling

  • Seamless integration with smart factory systems

Laser Cutting Case

🌍 Reliable Industrial Solution

Built for mass production, the ZAM330AT/330AD features:

  • Stable granite base for vibration-free cutting

  • Dust extraction and cooling for clean operation

  • Continuous 24/7 production capability

  • Proven reliability across automotive, telecom, medical, and consumer electronics industries

Request Information

The ZAM330AT/330AD Online Laser Depaneling Machine Solution is the perfect choice for manufacturers looking to achieve precision, efficiency, and automation in PCB and FPC depaneling. Designed for industrial-scale production, it delivers consistent quality and maximum productivity.

📩 Contact Us for Pricing & Details

Email: sales@seprays.com

WhatsApp: +86-189 2926 6433

Contact Us

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