ZAM330/330D Offline Precision Laser Depaneling Machine

The dual-platform design significantly reduces loading and unloading time, ensuring the laser remains in constant processing mode. With a processing area of 350mm x 520mm, it’s suitable for post-mount SMT panel separation, cover film windowing, and contour cutting. A camera-based target pre-alignment system eliminates the processing time associated with target alignment.

Direct data-driven: Immediate production and rapid product introduction.

Highly automated: Equipped with a material feeder, ready for immediate production.

High automation: Pushing the limits of mechanical design: Lasers replace molds, eliminating distortion.

Practical non-contact processing: Materials sublimate upon exposure to light, eliminating contact.

Eliminating the worry of stress damage: Precise laser control: Determined depth and volume, achieving micron-scale precision.

分类：激光分板机标签： offline laser depaneling machine, ZAM330

规格

No.	Technical Parameter	ZAM330
1	Platform Type	Dual platform
2	Processing Range	350 × 500 mm × 2 pieces
3	Repeat Accuracy	±2 μm
4	Overall Accuracy	±20 μm
5	X/Y Resolution	X/Y = 1 μm
6	Max. Material Thickness	≤2.0 mm
7	Platform Structure	Granite platform
8	Motor Type	直线电机
9	Laser Type	Nanosecond
10	Laser Power	15W, other options available
11	Focus Spot Diameter	20 μm ±5 μm
12	Adjustable Beam Expander	选配
13	High-speed Galvo	Germany Scanlab
14	Focal Length of Telecentric Lens	50 × 50 mm, f = 100 mm
15	CCD Structure	Paracentric
16	定位准确度	0.01 mm
17	Camera Resolution	1.3 MP / optional 5 MP
18	Camera Light Source	Standard red ring light
19	Pulse Auto-follow	Femtosecond / Picosecond standard
20	Galvo Pre-acceleration	有
21	Advanced Drilling Function	选配
22	Safety Protection	有
23	Dust Collector	Industrial vacuum
24	Cooling Method	Built-in water cooling
25	UPS Power Supply	Optional for the computer
26	Voltage Stabilizer	External, optional 7.5 kW or 15 kW
27	Display	17-inch
28	Control Software	DreamCreaTor 3
29	Data Processing Software	Circuit CAM7.5 Standard
30	File Formats	LMD, standard Gerber (RS-274-D), extended Gerber (RS-274-X), DXF, Excellon, Sieb & Meier, HP-GL, Barco DPF, ODB++
31	Operating Environment	22°C ±2°C
32	Power Supply	380 VAC / 50 Hz / 3.5 kW
33	设备重量	Approx. 2000 kg
34	Dimensions (W × H × D)	1600 × 1750 × 1600 mm

The ZAM330/330D Offline Precision Laser Depaneling Machine is designed for high-precision, non-contact depaneling of a wide range of materials, including FPC, PCBA, and ceramics. Ideal for industries like semiconductor, telecommunications, lighting, and more, this machine ensures clean, burr-free cuts with laser precision.

🔥 Key Features

Dual-Platform Design: Reduces material loading and unloading time, keeping the laser in continuous operation for improved efficiency.
Large Working Area: Processes 350mm × 520mm panels, ideal for post-SMT depaneling, coverlay cutting, and more.
High-Precision Laser: With advanced laser control, it achieves micron-level precision for cutting and shaping.
Non-Contact Processing: The laser sublimates the material without physical contact, eliminating stress and distortion.
Automatic Data-Driven Production: Direct input from product data to instantly begin processing, saving time and improving workflow efficiency.

💡 Advanced Technology

Engineers equipped the ZAM330/330D with a high-precision laser cutting system, designed to deliver optimal results even in the most complex paths. With advanced software integration, users benefit from powerful tools for editing, data processing, and system control. The machine also supports integration with MES systems, enabling seamless tracking, reporting, and data management.

⚙️ Versatile Applications

Perfect for a range of materials, including:

FPC
LCP
MPI
PI
FR4, FR5, and CEM
Polyester materials
Ceramics and RF materials

🌍 Industrial-Grade Reliability

The ZAM330/330D is designed for large-scale production, ensuring consistency and high throughput for mass manufacturing needs. Its marble base provides stability, and the advanced dust and cooling systems keep the machine running smoothly during continuous operations.

⚡ Laser software applications

Unique machining paths significantly improve machining results.

Specially optimized operation paths enhance machining efficiency.

Powerful graphics editing capabilities enable intuitive, convenient, and fast data processing.

A handful of completely independent kernels

Graphical human-computer interaction (GUI)

Intuitive and smooth, low learning curve

📈 Control & Process

Pulse Following: By controlling pulse synchronization, it ensures uniformity in line and energy, ensuring carbonization-free processing and achieving superior results.

Ultra-Clean Cutting: Perfectly integrated with the cutting process, fully automated operation, and flexible configuration deliver the perfect balance of speed, accuracy, and results.

High-Precision Laser Cutting System – Control and Process

Combined with Genmo’s independently developed software and hardware, it adapts to the mobile system from the ground up, meeting precision, speed, and complex path requirements.

Through close collaboration with the laser, advanced features such as Pulse Following and Skywriting are available as options.

💡 Laser Cutting Case

The ZAM330/330D Offline Precision Laser Depaneling Machine is your ideal choice for accurate, high-speed depaneling, with minimal manual intervention. It’s an essential tool for enhancing production efficiency and ensuring superior product quality in high-tech industries.