Live at NEPCON Shanghai 2026: Fully Automated Inline PCB Depaneling Solution

Seprays & Genitec is exhibiting at NEPCON Shanghai 2026.

Visitors can experience our fully automated Inline PCB Depaneling Solution running live on-site.

The system automates the entire process from board loading to scrap collection.

No manual intervention is required.

This helps manufacturers reduce labor costs and improve production efficiency.

A dual-worktable design enables simultaneous cutting and loading/unloading.

The result is a smoother production flow and higher throughput.

The solution can also be integrated with post-cut inspection and intelligent tray loading.

This creates a complete automated inline depaneling process for modern SMT production lines.

Our team is available at the booth to discuss applications, production challenges, and automation solutions.

📍 Hall 1, Booth 1H80
📅 June 2–4, 2026
🏢 Shanghai World Expo Exhibition & Convention Center

We look forward to meeting industry professionals and sharing the latest PCB depaneling technologies.

Bringing you the most authoritative inline PCB depaneling solution.

WhatsApp: +8618929266433

邮箱: sales@seprays.com