规格
| 项目 | ZAM320 |
|---|---|
| 切割区域 | 350*350mm |
| 移动方式 | 真空吸嘴吸附移动 |
| 流向 | single |
| 加工台面 | ±2μm |
| 机台重复精度 | ±20μm |
| 环境温度 | 22℃±2℃(71.6℉±2℉) |
| 设备平台 | 大理石平台 |
| 激光波长 | 355nm/532nm |
| 接收数据格式 | Gerber, HPGL, Sieb & Meier, Excellon, ODB++ |
| 操作系统 | Windows 7 / Windows 10 |
| 目标读取 | CCD automatic target capture. The target shape is irregular.
No Target, DIL is required. Modules |
| 切割软件 | DreamCreaTor |
| 数据处理软件 | CircuitCAM 7 |
| XYZ轴驱动方式 | 直线+电机 |
| 电压/电源要求 | AC380V 50/60Hz 2.5KW 三相 |
| 气压要求 | 0.6MPa,50L/min |
| 尺寸(宽*深*高) | 1050mm x 1600mm x 1270mm |
| 设备重量 | 700KG |
Product Introduction
1. Adopt a stable performance picosecond laser, ultraviolet and green laser, cold light source, laser cutting heat-affected zone is less than 10μm, high-precision scanning galvanometer, high precision, and long life.;
2. High-precision linear motor working platform, high precision and fast speed.
3. Optional CCD automatic positioning and automatic correction; vacuum adsorption fixed plate, no need for alternative fixtures.
4. The processing process is automatically controlled by computer software, and the software interface provides real-time feedback to understand the processing status in real time.
5. The minimum focusing spot can reach 10μm, which is suitable for fine cutting and drilling of any organic/inorganic materials.
The ZAM320 laser cutting machine from SEPRAYS is engineered for precision and efficiency in PCB and FPC depaneling. Its compact structure is ideal for space-conscious production environments, delivering high-speed and high-accuracy laser processing in a fully enclosed, safety-compliant design.
Equipped with a high-speed CCD vision correction system, the ZAM320 laser cutting solution ensures exact cutting paths with minimal manual intervention. Supporting a variety of nanosecond and picosecond UV and green lasers, it adapts seamlessly to a wide range of materials and board layouts.
From automated loading to clean and stress-free laser cutting, this all-in-one system reduces labor costs, improves quality, and fits easily into smart factory setups. Optional upgrades like MES integration, laser height sensors, and power detection enhance production traceability and control.
常见问题
你们提供什么服务?
We provide one-stop automated PCB depaneling solutions: laser, routing, punching, and V-CUT.
你们的机器能处理不同厚度的 PCB 吗?
是的,我们的机器设计用于处理各种厚度的PCB。我们可以提供定制和选项,以确保刚性板和柔性板的顺利加工。
你们为你们的机器提供什么类型的培训?
我们提供全面的现场培训,涵盖机器操作、维护和故障排除。我们还通过电话和电子邮件提供持续的技术支持。
你们能提供哪些售后服务?
●专属服务:
We will give users feedback within 10 minutes on any problems they encounter when using the device, and establish a 1V1 exclusive after-sales service group for users.
●远程服务:
Provide users with a7/24-hourH hotline based on feedback on fault information, analyze, locate, and solve the fault through remote telephone support, remote login, and other methods.
●现场服务:
Arrive at the work site within 8 hours and solve the problem within 1 working day. 2-4 days of training on equipment safety, operation, and application. We will handle any breach of contract according to the contract provisions.
●服务地点:
我们在海外31个国家和地区设有销售和服务支持,尽快响应客户当前和未来的需求。
●标杆服务:
每次回访电话回访;视频教程+电话指导配件更换、设备维护;每年12月免费回访一个月,持续收集用户建议,持续更新迭代软件,提升用户生产质量和效率,并提供终身维护。
应用领域
Industries that demand high-precision and high-efficiency board separation actively use our PCB depaneling solutions.
主要应用领域包括:
●消费电子产品——智能手机、平板电脑、笔记本电脑和可穿戴设备。
●汽车电子——用于 ADAS、信息娱乐系统和 EV 组件的 PCB。
●医疗设备——诊断和监测设备中的精密电子设备。
●电信——网络和通信硬件。
●工业电子——控制系统、自动化设备和物联网设备。
●航空航天与国防——用于航空电子和军事应用的高可靠性 PCB。
Contact us now and discover why over 3,000 leading companies trust SEPRAYS for their PCB depaneling needs.





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