ZAM350/PCB FPC 레이저 절단

The ZAM350 Single Large Platform Laser Depaneling Equipment features a classic bridge structure with independent X/Y axis motion, ensuring stable and precise PCB processing. The processing head moves along the X-axis while the clamping platform moves along the Y-axis, allowing efficient, interference-free operation. Optional features include UV lasers (15W–25W), green lasers (35W–60W), laser height sensors, barcode readers and MES integration, laser power detection, and upgrade to inline operation. Trusted by top 500 companies worldwide, it provides a reliable and high-precision solution for laser PCB depaneling.

설명

모델 ZAM350
유효한 크기로 절단 515mm*520mm
절단 기능 Tweening to straight line, L shape, shape, Circle, Arc
프로세스 테이블 단일
반복 정밀도 ±2μm
절단 정밀도 ±20μm
주변 온도 22℃±2℃(71.6℉±2℉)
플랫폼 대리석 테이블
Transfer 모델(옵션) 3 단계 추적 전송
레이저 파장 355nm/532nm
수신 데이터의 외형 Gerber,HPGL,료입&Meier,Excellon,ODB++
운영 체제 Windows7/Windows10
대상 읽

CCD automatic target cap. True Target shape is irregular.

No Target, DIL is required. Modules

절단 소프트웨어 DreamCreaTor
데이터 처리 소프트웨어 CircuitCAM7
XYZ 축 운전 모드 선+servo 모터
전압/전원 요구사항 AC380V50/60Hz2.5KW three phase
압축 공기를 넣은 압력이 필요조건 0.6MPa,50L/min
크기(W*D*H) 1249mm*1760mm*1562mm
체중 1500KG

Laser height measurement

The addition of a laser height measurement module can detect whether the height of the PCBA is correct when it is placed in the fixture, preventing the PCBA board from being placed incorrectly or small broken boards in the fixture from causing cutting offset damage during board separation.

Barcode reading

The barcode camera can dynamically collect and recognize QR codes at any position. Practical application cases.

The addition of a barcode reader can record the barcode on the PCBA into the computer, or receive server messages through the MES system to identify the NG board barcode and then classify it.

Quick line change

Call the original program to avoid fixture errors, and realize fast program retrieval and fast line change.

High utilization rate

With more than 30 years of independent research and development, we have created stable and reliable software for the board separation machine that prevents poor cuts caused by bugs.

Exclusive functions

The board splitter adopts an integrated welding design structure, which is stable and strong.
It adopts cast aluminum integrated molding, which is anti-oxidation, non-deformation, non-shifting, long life, and guaranteed precision.

Central control system management

Optional central control system: unified management and real-time monitoring through a network.
Remote device unified management: remote monitoring through a mobile phone APP.

The ZAM350 laser cutting machine is engineered for high-precision, stress-free depaneling of rigid and flexible PCBs on a large single-platform setup. Adopting a classic bridge-type structure, the ZAM350 utilizes an independent X/Y axis motion design: the cutting head glides smoothly along the X-axis on a rigid bridge, while the clamping platform travels precisely along the Y-axis. This separation of axes ensures consistent stability, speed, and accuracy—especially critical for intricate PCB layouts.

With optional UV (15W–25W) or green lasers (35W–60W), the ZAM350 delivers clean, burr-free edges across materials like FR4, copper-clad laminates, and polyimide. The enclosed cutting area provides enhanced operator safety, and it’s fully compatible with MES systems via standard interface ports. Optional add-ons like a laser height sensor, barcode reader, and camera-based power detection further boost its versatility.

Designed for maximum productivity, the ZAM350 laser cutting platform is also upgradeable to an inline configuration—ideal for scaling alongside SMT lines.

📩 Contact us now and discover why over 3,000 leading companies trust SEPRAYS for their PCB depaneling needs.

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